Signal Integrity Engineering Redefined: To Include RF Stages Deploying CMOS VLSI Devices and Traces (As in Bluetooth)
DOI:
https://doi.org/10.14738/tmlai.1306.19675Keywords:
Signal integrity, CMOS VLSI, Submicron RF devices, IEEE 802.11 devices, PCB tracesAbstract
This paper revisits the general definition of signal integrity (SI) engineering to include relevant considerations applied to RF stages (front- and/or back-end) of wireless system compliant devices such as Bluetooth, ZigBee, mobile phone etc. Apart from traditionally viewed (baseband) impairments specific to digital waveforms, possible artifacts caused by RF-stage electromagnetics that influence the SI undesirably are identified. Hence, SI is redefined more comprehensively to include RF contexts. Relevant ADSTM-based simulation results on transmit-receive (TR)-switch performance in a CMOS-VLSI based Bluetooth circuit are presented and discussed.
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Copyright (c) 2025 Perambur Neelakanta, Bethany Talbot, Dolores DeGroff, Diana Portal, Aziz Noori

This work is licensed under a Creative Commons Attribution 4.0 International License.
