Signal Integrity Engineering Redefined: To Include RF Stages Deploying CMOS VLSI Devices and Traces (As in Bluetooth)

Authors

  • Perambur Neelakanta Department of Electrical Engineering & Computer Science Florida Atlantic University, Boca Raton, Florida 33431, USA
  • Bethany Talbot Department of Electrical Engineering & Computer Science Florida Atlantic University, Boca Raton, Florida 33431, USA
  • Dolores DeGroff Department of Electrical Engineering & Computer Science Florida Atlantic University, Boca Raton, Florida 33431, USA
  • Diana Portal Department of Electrical Engineering & Computer Science Florida Atlantic University, Boca Raton, Florida 33431, USA
  • Aziz Noori Department of Electrical Engineering & Computer Science Florida Atlantic University, Boca Raton, Florida 33431, USA

DOI:

https://doi.org/10.14738/tmlai.1306.19675

Keywords:

Signal integrity, CMOS VLSI, Submicron RF devices, IEEE 802.11 devices, PCB traces

Abstract

This paper revisits the general definition of signal integrity (SI) engineering to include relevant considerations applied to RF stages (front- and/or back-end) of wireless system compliant devices such as Bluetooth, ZigBee, mobile phone etc. Apart from traditionally viewed (baseband) impairments specific to digital waveforms, possible artifacts caused by RF-stage electromagnetics that influence the SI undesirably are identified. Hence, SI is redefined more comprehensively to include RF contexts. Relevant ADSTM-based simulation results on transmit-receive (TR)-switch performance in a CMOS-VLSI based Bluetooth circuit are presented and discussed.

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Published

2025-12-07

How to Cite

Neelakanta, P., Talbot, B., De Groff, D., Portal, D., & Noori, A. (2025). Signal Integrity Engineering Redefined: To Include RF Stages Deploying CMOS VLSI Devices and Traces (As in Bluetooth). Transactions on Engineering and Computing Sciences, 13(06), 79–92. https://doi.org/10.14738/tmlai.1306.19675